Dukovic, John: search on Z-Library

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1

Simulation of Leveling in Electrodeposition

Dukovic, John O.

Journal:

Journal of The Electrochemical Society

Year:

1990

Language:

english

File:

PDF, 1019 KB

english, 1990

2

The Influence of Attached Bubbles on Potential Drop and Current Distribution at Gas-Evolving Electrodes

Journal:

Journal of The Electrochemical Society

Year:

1987

Language:

english

File:

PDF, 1.52 MB

english, 1987

3

Evaluating Oxide Liner and Copper Barrier Integrity of Through-Silicon-Via by Electrical Characterization and Microanalysis

Yu, Minrui, Bhushan, Bharat, Kumar, Niranjan, Park, Mun Kyu, Hua, John, Bolagond, Shwetha, C-T. Chan, Anthony, Jin, Miao, Uritsky, Yuri, Toh, Chin-hock, Sundarrajan, Arvind, Dukovic, John, Ramaswami,

Journal:

MRS Proceedings

Year:

2013

Language:

english

File:

PDF, 21.74 MB

english, 2013

4

[ECS 214th ECS Meeting - Honolulu, HI (October 12 - October 17, 2008)] ECS Transactions - Morphology of Electrodeposited Cu on 300 mm PEALD Ru Substrates

Kelly, James, Vo, Tuan, Van der Straten, O., Huang, Qiang, Baker O'Neal, Brett, Shao, X I., Chiang, Sunny, Dukovic, John

Year:

2008

Language:

english

File:

PDF, 1.68 MB

english, 2008

5

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Robust TSV via-middle and via-reveal process integration accomplished through characterization and management of sources of variation

Kumar, Niranjan, Ramaswami, Sesh, Dukovic, John, Tseng, Jennifer, Ding, Ran, Rajagopalan, Nagarajan, Eaton, Brad, Mishra, Rohit, Yalamanchili, Rao, Wang, Zhihong, Xia, Sherry, Sapre, Kedar, Hua, John,

Year:

2012

Language:

english

File:

PDF, 3.37 MB

english, 2012

6

[IEEE 2013 IEEE International Interconnect Technology Conference - IITC - Kyoto, Japan (2013.06.13-2013.06.15)] 2013 IEEE International Interconnect Technology Conference - IITC - Fabrication and electrical characterization of 5×50um through silicon vias for 3D integration

Bhushan, Bharat, Yu, Minrui, Dukovic, John, Wong, Loke Yuen, Kitowski, Aksel, Park, Mun Kvu, Hua, John, Bolagond, Shwetha, Chan, Anthony C-T, Toh, Chin Hock, Sundarrajan, Arvind, Kumar, Niranjan, Rama

Year:

2013

Language:

english

File:

PDF, 616 KB

english, 2013

7

Excitation-Rate Determines Product Stoichiometry in Photochemical Ammonia Production by CdS Quantum Dot-Nitrogenase MoFe Protein Complexes

Brown, Katherine A., Ruzicka, Jesse, Kallas, Hayden, Chica, Bryant, Mulder, David W., Peters, John W., Seefeldt, Lance C., Dukovic, Gordana, King, Paul W.

Journal:

Year:

2020

File:

PDF, 1.87 MB

2020

8

Defining Intermediates of Nitrogenase MoFe Protein During N 2 Reduction Under Photochemical Electron Delivery from CdS Quantum Dots

Chica, Bryant, Ruzicka, Jesse, Kallas, Hayden, Mulder, David W., Brown, Katherine A., Peters, John W., Seefeldt, Lance C., Dukovic, Gordana, King, Paul W.

Journal:

Journal of the American Chemical Society

Year:

2020

File:

PDF, 491 KB

2020

9

Material, Process and Geometry Effects on Through-Silicon Via Reliability and Isolation

Karmarkar, Aditya P, Xu, Xiaopeng, Ramaswami, Sesh, Dukovic, John, Sapre, Kedar, Bhatnagar, Ajay

Journal:

MRS Proceedings

Year:

2010

Language:

english

File:

PDF, 481 KB

english, 2010

10

SPIE Proceedings [SPIE Fibers '91, Boston, MA - Boston, MA (Tuesday 3 September 1991)] Microelectronic Interconnects and Packages: Optical and Electrical Technologies - Application of electrodeposition processes to advanced package fabrication

Krongelb, Sol, Dukovic, John O., Komsa, M. L., Mehdizadeh, S., Romankiw, Lubomyr T., Andricacos, Panayotis C., Pfeiffer, A. T., Wong, Kason, Arjavalingam, Gnanalingam, Pazaris, James

Year:

1991

Language:

english

File:

PDF, 642 KB

english, 1991

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